Cohu’s Semiconductor Equipment Group Receives Multi-Unit Order for Next Generation T-Core Thermal Subsystem
The company’s T-Core thermal technology enables higher test yield for ICs that power a wide range of smartphones, tablets, and other consumer devices. T-Core can be integrated in Cohu’s production test handlers or in batch test systems for cost-effective, parallel testing of hundreds of ICs.
“We are pleased to see our thermal technology that is today the
benchmark for testing mid and high power processors, being used in new
applications for the mobile market,” said Luis Müller, President of
Cohu’s
Cohu’s thermal technology optimizes test yield of high-end devices, including microprocessors used in laptops, PCs and cloud-servers, as well as graphic processors, mobile application processors and a variety of other complex ICs. T-Core reflects Cohu’s commitment to continued leadership in thermal technology to cost-effectively address evolving market requirements. Current T-Core configurations range from single to >500 devices tested in parallel at 8W to 350W power dissipation.
Forward Looking Statements:
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Source:
Cohu, Inc.
Jeffrey D. Jones - Investor Relations
(858) 848-8106